Advanced Simulation Techniques for Thick Photoresist Lithography

نویسندگان

  • Warren W. Flack
  • Gary Newman
چکیده

A great deal of photolithographic activity in recent years has been centered on thick photoresist films. Thin film heads (TFH), micromachining and sensor fabrication are examples of applications requiring this type of processing. The needs of the TFH industry are currently the technology driver for thick photoresist processing. Modern TFH manufacturing processes require 1 μm resolution in layers ranging in thickness from 5 to as much as 25 μm. These large aspect ratios not only make the lithographic process difficult, but add complexity to the evaluation and measurement of experimental wafers. This is particularly true for the large number of measurements needed for process optimization and control. Well-calibrated and easy to use modeling techniques for analysis of the impact of optical system design and photoresist process changes would be extremely valuable for process lithography engineers.

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تاریخ انتشار 1997